Cutting-Edge Technologies in Electronics, Precision Instruments and Optical Techniques

Residual stress measurement becomes much easier than before.

Meeting the needs of the times, our unique technology brings customers easy operation in evaluating Residual Stress and Retained Austenite by the X-ray diffraction technique.

μ-X360J Portable X-ray Residual Stress Analyzer
Portable X-Ray Residual Stress Analyzer

μ-X360J

The μ-X360J is the world’s lightest and smallest residual stress analyzer. It’s a non-destructive measurement system for metals to obtain the residual stress, retained austenite and FWHM data based on X-ray diffraction technique.

μ-X360J Portable X-ray Residual Stress Analyzer
μ-X360J Portable X-ray Residual Stress Analyzer

How the analyzer works

  1. Place a sample under the sensor unit.
  2. Start measurement wizard.
  3. Adjust incident angle, working distance, and measurement spot.
  4. Close the shielding door and hit the start button.
  5. Result is displayed after 40 seconds.
μ-X360J Portable X-ray Residual Stress Analyzer

Products

A cost-effective, compact and high-precision way to non-destructively determine residual stress in polycrystalline materials.

A versatile robotic system designed to accurately map residual stress and FWHM.

A compact, lightweight system that measures crystallinity, plane orientation, and more.

An inline single crystal orientation system that easily measures large samples.

A fast, non-destructive way to accurately test case depth of carburized hardened steel and induction hardened steel.

With this in-plane hardness tester, hardness variation can be determined. Applicable to machining burn or grinding burn evaluation.

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Speak with an Equipment Testing Expert

We know our technology is leading the industry. Allow us to show you the benefits of working with Pulstec. Contact us today for a free demonstration on-line or at your facility.